Product Selection

Sieve Analysis, Laser Diffraction, Static or Dynamic Image Analysis?
A comparison of measurement techniques

For the physical characterization of particles Retsch Technology offers a range of optical particle analyzers.
The table and whitepaper below explain the advantages and disadvantages of different measurement techniques.

Retsch Technology is the only worldwide supplier of DIA, laser diffraction and sieve analysis equipment with an extensive understanding of the strengths and weaknesses of each method.
Dynamic Image
Analysis
(CAMSIZER)
Sieve Analysis
(RETSCH)
Laser Diffraction Static Image
Analysis
(opt. Microscope)
Wide dynamic measurement range
Reproducibility and repeatability
High resolution for narrow distributions
Particle shape analysis
Direct measurement technique
Compatibility of results
with other techniques
Reliable detection of oversized grains
Robust hardware,
easy operation for routine analysis
Analysis of individual particles
High measurement speed,
short measurement times
Measuring range 0.8 µm - 30 mm 10 µm - 125 mm 10 nm – 5 mm 0.5 µm – 500 µm
  • White Paper: Comparison of Methods

    Different measuring techniques provide different results – but what is the truth? The most common techniques to determine the particle size distribution are dynamic image analysis (DIA), static laser light scatter-ing (SLS, also called laser diffraction) and sieve analysis. This white paper presents the advantages and drawbacks of each technique, their comparability among each other as well as detailed application examples.